LG Electronics Accelerates Expansion of AI Data Center HVAC Business

Participating in 'DCW 2026' in Washington D.C., USA

From Data Center Thermal Management to Energy Optimization

LG Electronics is accelerating the expansion of its B2B business with comprehensive heating, ventilation, and air conditioning (HVAC) solutions designed to simultaneously address thermal management and energy optimization for artificial intelligence (AI) data centers.

LG Electronics participated in 'Data Center World (DCW) 2026,' held from the 20th to the 22nd (local time) in Washington D.C., USA, unveiling AI data center-oriented HVAC solutions including thermal management solutions. LG Electronics

On April 21, LG Electronics announced that it had unveiled a wide range of HVAC solutions for AI data centers, including thermal management solutions, at 'Data Center World (DCW) 2026', held in Washington D.C., USA, from the 20th to the 22nd (local time). DCW is an exhibition where major tech and semiconductor companies participate, featuring seminars and client meetings on a variety of topics such as AI technology and trends, infrastructure development, and energy efficiency.

At this exhibition, LG Electronics introduced liquid cooling solutions that effectively manage the heat generated by high-performance computing chips using liquid. A representative product is the coolant distribution unit (CDU), which utilizes a 'Direct-to-Chip (DTC)' cooling method, where a metal plate is placed directly on top of the chip to allow coolant to flow. LG’s CDU has more than doubled its cooling capacity from the previous 650 kilowatts (kW) to 1.4 megawatts (MW) and is designed with virtual sensor technology so that the cooling system remains stable even if certain sensors fail.

For the first time, LG Electronics also showcased immersion cooling solutions currently in joint development with U.S.-based immersion cooling company GRC and SK Enmove. Immersion cooling technology involves submerging heat-generating electronic devices, such as data center servers, directly into electrically non-conductive special cooling fluid. The newly unveiled products include an immersion cooling tank system co-developed with GRC and a cooling fluid co-developed with SK Enmove.

Based on more than 10 years of accumulated expertise in data center cooling technology, LG Electronics also demonstrated differentiated capabilities in the field of air cooling. The company is expanding its lineup with products such as air-cooled free-cooling chillers equipped with high-performance inverter compressors for efficient energy load management.

With 'Core Tech'—the company’s proprietary technology for key HVAC components—LG Electronics independently develops high-performance, high-efficiency core air conditioning parts such as magnetic compressors, gas foil compressors, computer room air handlers (CRAH), EC-fans, and fan motors, delivering differentiated solutions.

The 'Data Center Cooling Management (DCCM)' system, LG Electronics’ integrated software system for data center management, remotely monitors complex equipment such as CDU, CRAH, and chillers, performing data analysis and optimal control. It detects changes in component lifespan and early signs of anomalies in advance, enabling preemptive responses and helping prevent server shutdowns before they occur.

In addition to cooling technology, LG Electronics is strengthening its software (SW) and power infrastructure solutions to improve energy efficiency. Given that AI data centers consume large amounts of electricity, increasing energy efficiency is considered a core technology, as it reduces power consumption while boosting data processing capacity. LG Electronics offers total solutions for AI data centers that combine energy efficiency solutions with HVAC systems.

At this exhibition, LG Electronics is unveiling an energy operation platform developed in collaboration with PADO, a cleantech startup spun off from LG NOVA, the company’s North America Innovation Center. This platform monitors the cooling and power systems of data centers in real time, identifies wasted energy, and redistributes it to where it is needed most.

The company is also introducing a direct current (DC) grid solution for data center operations, co-developed with LG Energy Solution, LS Electric, and LS Cable. The DC grid solution minimizes the power conversion processes typical in alternating current (AC) systems, thus reducing energy loss. In conventional systems, around 25% of energy can be lost, but this solution can reduce initial power loss to about 15%.

Jaesung Lee, President and Head of the ES Business Division at LG Electronics, stated, "By leveraging our comprehensive solution capabilities and differentiated technologies, from thermal management to energy efficiency, we will continue to expand business opportunities in the AI data center HVAC market."

This content was produced with the assistance of AI translation services.