Ministry of Science and ICT Announces 'Advancement of Semiconductor Future Technology Roadmap'
Addition of Semiconductor Device Miniaturization, System Semiconductors, and Advanced Packaging to Existing Roadmap
Establishment of 59 Core Technology Research Topics: 14 Processes, 19 Devices, and 26 Designs
The Ministry of Science and ICT announced the 'Advanced Semiconductor Future Technology Roadmap' reflecting the latest semiconductor technologies on the 27th at EL Tower in Seoul.
The 'Advanced Semiconductor Future Technology Roadmap' enhances the existing semiconductor future technology roadmap by incorporating changes in the technological environment such as acceleration of semiconductor device miniaturization and memory high integration, AI-based new service creation and demand-based semiconductor diversification, advanced packaging accelerated by HBM, and competition in ultra-fine semiconductor process technologies, strengthening semiconductor device miniaturization, system semiconductors, and advanced packaging.
The advanced roadmap consists of a total of 59 core technologies by adding 14 key technologies to the existing semiconductor future technology roadmap. The 59 core technologies are categorized by field as follows: ▲ 19 for new device memory and next-generation device development ▲ 26 for AI, 6G, power, and automotive semiconductor design fundamental technology development ▲ 14 for process fundamental technology development for ultra-miniaturization and advanced packaging.
Based on the advanced roadmap, next-generation new device development plans to respond to semiconductor device miniaturization were also discussed. Starting from this discussion, the Ministry of Science and ICT plans to initiate new projects related to next-generation semiconductor devices to overcome the limits of semiconductor device miniaturization.
At the roadmap announcement event, the Institute of Electrical and Electronics Engineers (IEEE) introduced the semiconductor technology roadmap (IRDS), and SK Hynix and Hanamicron presented the latest trends in semiconductor-related technologies, sharing the global research status.
At the 'Semiconductor Achievement Exhibition,' eight major semiconductor research achievements were displayed, including ▲ Professor Woo-Young Choi of Seoul National University’s 'NEM associative memory based on CMOS wiring technology - enhanced neural network' and ▲ Professor Tae-Joo Park of Hanyang University’s '4K-class high-reliability crossbar integrated device using interface-type alkaline ion memristor,' along with demonstrations in five fields such as KIST’s 'Neuromorphic Processor' and FuriosaAI’s 'Artificial Intelligence Deep Learning Processor and Module.'
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Hwang Pan-sik, Director of the Research and Development Policy Office at the Ministry of Science and ICT, stated, “The government will continue to advance the Semiconductor Future Technology Roadmap and strategically promote semiconductor policies and project planning based on it,” adding, “Based on the semiconductor future technology roadmap, the government, industry, academia, and research sectors will strive to nationally consolidate semiconductor R&D capabilities.”
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