Participation in SEMI-hosted 'Semicon China 2023'
China's Largest Semiconductor Exhibition... 50,000 Visitors

Hanwha Precision Machinery, a Hanwha manufacturing solutions specialist, announced on the 30th that it participated in the ‘SEMICON CHINA 2023’ exhibition held from June 29 to July 1 at the Shanghai New International Expo Center in China.


‘SEMICON CHINA 2023’ is the largest semiconductor exhibition in China, hosted by the Semiconductor Equipment and Materials International (SEMI), where over 1,000 manufacturers exhibit equipment annually and around 50,000 visitors attend.


The flip chip bonder exhibited this year is equipment that attaches semiconductor chips directly to substrates using small bump-shaped solder bumps instead of metal wires when fixing semiconductor chips to substrates. This is an advanced method compared to the conventional die bonder. Due to this characteristic, it enables smaller and finer processes, mainly used in compact smart devices and high-performance semiconductor processes.


Hanwha Precision Machinery Targets Global Semiconductor Packaging and Testing Companies in China View original image

Hanwha Precision Machinery’s flagship flip chip bonder, the ‘SFM3,’ has been recognized for its excellent productivity and user convenience for years by top 3 integrated device manufacturer (IDM) customers. It is receiving significant interest from local companies at this exhibition, and there are plans to expand sales to global semiconductor packaging and testing specialists (OSAT) as well.


Seok Myung-gyun, head of the Industrial Equipment Division at Hanwha Precision Machinery, said, “We are intensifying our approach to not only IDMs but also major global OSATs with next-generation technology, and we will further enhance product competitiveness compared to competitors through continuous technology development and automation function improvements.”



Hanwha Precision Machinery operates manufacturing equipment businesses including SMT, semiconductor packaging, and automatic lathes. In the semiconductor packaging equipment sector, it competes with global precision machinery manufacturers while independently designing, producing, and providing services.


This content was produced with the assistance of AI translation services.

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