[Concall] SK Hynix "Applying 6th Gen HBM4 Logic Die... One Team with TSMC"

On the 24th, SK Hynix stated during the Q3 earnings conference call, "For the 6th generation High Bandwidth Memory (HBM), HBM4, the number of IOs will be doubled and a new scheme will be applied to achieve low power consumption," adding, "Technologically, many changes are expected, including the first use of (TSMC's) logic dies."

They continued, "A much deeper technical exchange beyond the existing test scope is necessary," and said, "We are collaborating by forming a one-team partnership between our company and the foundry partner (TSMC)." They also mentioned, "The advanced MR-MUF process is being applied, and we aim for customer shipments in the second half of 2025."

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