[Concall] SK Hynix "Developing Technology in Preparation for 6th Generation HBM4 Demand Starting 2026"
Review of Both Hybrid Bonding and Advanced MR-MUF
On the 25th, SK Hynix stated during the Q2 earnings conference call that "demand for 16-layer HBM4 (6th generation High Bandwidth Memory product) is expected to arise in 2026, so we plan to develop the technology in preparation for this."
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They added, "We are reviewing both advanced MR-MUF and hybrid bonding methods among packaging technologies," and "We will adopt the optimal method that meets customer demand."
![M16 site view at SK Hynix Icheon campus. <br>[Photo by SK Hynix]](http://www.asiae.co.kr/news/img_view.htm?img=2022102516371881839_1666683438.jpg)
SK Hynix also mentioned, "The effect of hybrid bonding may vary by company," and explained, "To apply hybrid bonding technology to mass production systems, the technology must be further advanced, and thorough characteristic and quality verification at the system level through collaboration with customers and partners is necessary."
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