[Special Stock] Protek Achieves 100x Productivity in Semiconductor Assembly with Gas Technology... Surpassing Japanese Technology

[Asia Economy Reporter Hyungsoo Park] Protek's stock price has surged for two consecutive days. The news that the company has developed a high-efficiency commercialization technology to assemble semiconductor chips thinner than a human hair without damage, using a method that evenly assembles multiple semiconductor chips without contact by utilizing gas, appears to be influencing the stock price.

As of 9:12 AM on the 12th, Protek is trading at 22,900 KRW, up 24.15% from the previous day.

The stock closed at the upper price limit the day before.

The Korea Institute of Machinery and Materials announced that on the previous day, Deputy Director Junyeop Song and Chief Researcher Jaehak Lee’s team from the Advanced Production Equipment Research Department, together with the domestic company Protek, developed core equipment technology that can increase the productivity of semiconductor post-processing (packaging) by more than 100 times.

They developed a technology that applies pressure to chips without direct contact by using gas. They also developed a technology that can uniformly raise or lower the temperature by about 20 degrees per second. The manufacturing technology for efficiently assembling semiconductor chips is called a ‘gangbonder,’ but there are no globally commercialized cases yet.

The research team used the developed gangbonder technology to roughly assemble chips at low temperatures, then completed a process to electrically connect a large number of chips simultaneously. They succeeded in completing equipment that can arrange flexible semiconductor chips with a thickness of 0.02mm, thinner than a human hair, on a substrate without damage and stack them within an error range of 0.002mm.

Deputy Director Junyeop Song said, "The gangbonder equipment is world-class technology that surpasses the highest-spec semiconductor assembly equipment led by a few companies in semiconductor equipment-leading countries such as Europe and Japan."

He added, "It can be applied not only to wearable devices, smart cards, medical devices, and micro-LED displays but also to ultra-precision assembly fields such as wafer and panel-level packages like artificial intelligence (AI) semiconductor packages. We expect it to expand into the creation of new equipment industries due to the rapid growth of related industries."

This content was produced with the assistance of AI translation services.