Hanmi Semiconductor Launches 'Silver Phoenix' TC Bonder Team Dedicated to HBM4 Production

A Team of Over 50 Skilled Semiconductor Equipment Specialists Formed

On June 5, Hanmi Semiconductor announced the launch of Silver Phoenix, a dedicated team responsible for the TC Bonder 4, which is specialized equipment for the production of sixth-generation high bandwidth memory (HBM), known as HBM4.

Hanmi Semiconductor launched the Silver Phoenix dedicated team for TC Bonder 4. Photo by Hanmi Semiconductor

Silver Phoenix consists of more than 50 skilled semiconductor equipment specialists, formed to respond quickly to a wide range of customer technology requests, as well as to handle equipment maintenance and optimization.

Hanmi Semiconductor is also providing 30 eco-friendly hybrid four-wheel drive (4WD) sport utility vehicles (SUVs) to ensure the dedicated team can deliver safe and prompt premium services.

The TC Bonder is essential equipment for manufacturing HBM for artificial intelligence (AI) semiconductors. HBM is produced by stacking multiple DRAM chips, and the TC Bonder is used in the process of applying heat and pressure to fix the DRAM chips together. The TC Bonder 4, released by Hanmi Semiconductor last month, is a dedicated device for producing HBM4. It has significantly improved productivity and precision compared to previous models, in line with the high precision requirements of HBM4.

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