ISC Selected for National Strategic Technology Project with AI Semiconductor Test Technologies for Glass Substrates and HBM

Selected as the First in the Industry Thanks to Outstanding Technological Prowess

Global semiconductor test solution company ISC announced on the 15th that it has been selected for the national strategic technology project in the semiconductor and display fields.

The national strategic technology project is an initiative by the Ministry of Economy and Finance to support strategic investments in 12 fields, including semiconductors and displays, artificial intelligence (AI), and secondary batteries, to respond to global technology hegemony competition, secure technological sovereignty, and foster future growth. It focuses on promoting the development of nationally important technologies through government budgets and accelerating innovation across related industries.

ISC was selected for the national strategic technology project with its AI semiconductor and advanced packaging test socket technologies. Additionally, as the advanced semiconductor packaging project was included in the 'Top 10 National Strategic Technology Projects,' which systematically manages investment and follow-up support for representative projects requiring focused assistance, the research and development (R&D) support benefits ISC receives are expected to expand further.

This selection for the national strategic technology project corresponds to all seven core technologies designated by the government to overcome the next-generation packaging technology gap: ▲Chiplet ▲Next-generation Interposer ▲3D Packaging ▲High-density 2.5D ▲Fan-Out ▲FC-BGA ▲Packaging Test, all of which apply to ISC's technologies. This recognition highlights ISC's world-class post-process test technology capabilities.

An ISC representative stated, "This achievement is a meaningful result that proves ISC's competitiveness in test socket technology beyond simple R&D support benefits. Based on government support, we are approaching commercialization in the high-bandwidth memory (HBM) and AI semiconductor test solution fields, including glass substrates, and will continue to strengthen our global leadership."

This content was produced with the assistance of AI translation services.