Ulsan City and UNIST Selected as the Only Domestic Project for 'Semiconductor Packaging' Business

National Semiconductor Research Lab Support Project Announcement

Green Light for Attracting Foreign Companies and Expanding Investment

The semiconductor core industry development project jointly promoted by Ulsan City and Ulsan National Institute of Science and Technology (UNIST) has set sail.

Ulsan City announced on the 6th that it was finally selected in the ‘2023 National Semiconductor Research Laboratory Support Core Technology Development Project’ competition hosted by the Ministry of Science and ICT.

The two institutions participated in this competition with a project to develop core semiconductor packaging technology based on 3D printing and achieved fruitful results. Semiconductor packaging refers to the process of electrically packaging to connect semiconductors and devices.

Following the selection, UNIST will receive approximately 2.25 billion KRW in national funding over about five years from this year until 2027. Ulsan City also plans to provide 50 million KRW annually starting next year.

Among the total of 10 university semiconductor laboratories selected in this competition, UNIST is the only one in the advanced packaging field.

Ulsan is expected to lead other regions in developing advanced packaging technology based on private demand and in cultivating experts such as master's and doctoral degree holders in the advanced packaging field.

UNIST’s packaging production technology using a three-dimensional printing-based additive manufacturing process is an unprecedented technology. In a situation where producing high-performance chips using multi-chip packaging is becoming important, proactive investment has secured advantageous positions for various patents and market preemption.

In particular, it is a completely new technology compared to the existing manufacturing process relying on etching, which can diversify packaging forms and drastically reduce production costs.

It is expected to become a foundation for South Korean semiconductor design companies to lead the high-performance system semiconductor market.

Also, based on the entire process of UNIST’s Nano Device Process Lab and the post-process of the 3D printing semiconductor packaging lab, it will be possible to build the entire semiconductor supply chain from design, process, packaging, to testing, creating new regional growth engines such as attracting advanced packaging offshore companies and expanding investment.

An official from Ulsan City said, “Taking this project selection as an opportunity, we plan to establish a Ulsan-type semiconductor development strategy to systematically support all areas including infrastructure building, workforce training, technology development, and commercialization by gathering the region’s semiconductor foundation and excellent human resources.”

This year, Ulsan City achieved results by being selected for a total of four competitive projects in the semiconductor workforce training field, including this competition, ▲Support Project for Semiconductor Specialized Graduate Schools ▲Semiconductor Major Track Project ▲Advanced Industry Talent Training Bootcamp Project.

Status of Semiconductor Field Contest Application Projects,

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