August 30 - September 1 at Suwon Convention Center
First Local Government-Level Semiconductor Event Draws Attention

Gyeonggi Province will hold a semiconductor-related industry exhibition for the first time at the local government level, rather than by the central government.


Gyeonggi Province announced on the 19th that, in cooperation with Suwon City, it will hold the "Next-Generation Semiconductor Packaging Equipment and Materials Industry Exhibition (ASPS)" for three days from August 30 to September 1 at the Suwon Convention Center. This is the first semiconductor-related exhibition hosted by a local government.


Gyeonggi-do and Suwon City Hold 'Semiconductor Packaging Industry Exhibition' View original image

The event is sponsored by related organizations and groups including the Next-Generation Convergence Technology Institute, Suwon Chamber of Commerce and Industry, Korea Electronics Technology Institute (KETI), Korea Microelectronics Packaging Research Association, Korean Society of Microelectronics and Packaging, Materials, Parts and Equipment Technology Convergence Forum, Hanyang Advanced Packaging Research Center, and Hanyang University Link 3.0 Project Group.


'Semiconductor packaging' refers to the post-processing steps after semiconductor device manufacturing, such as transmitting signals and power of the device and protecting the semiconductor chip from external environments. It is recognized as a method to overcome the limits of ultra-fine processes and is a field where global technological competition is intensifying.


At this industry exhibition, new technologies and products will be introduced to experts from post-processing (OSAT) and related industries in academia and research.


During the event, the ‘Semiconductor Packaging Conference’ and the ‘KAMP (Korea Microelectronics Packaging Research Association) Symposium’ will also be held to present the latest trends and technological developments in semiconductor packaging.


The province explained that it plans to offer various programs such as new technology presentations and technical seminars by individual participating companies, as well as job fairs.



Song Eun-sil, head of the Semiconductor Industry Division of Gyeonggi Province, said, “The importance of the advanced packaging industry is being emphasized due to the miniaturization limits of all semiconductor processes. We have prepared this event to support semiconductor packaging companies within Gyeonggi Province.”


This content was produced with the assistance of AI translation services.

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