Hanwha Precision Machinery Semiconductor Post-Process Core Equipment 'Die Bonder' Presidential Citation

Success in Developing Die Bonder
1 Year and 6 Months After Applying World's First Automatic Correction Technology

Jang Young-jin, Vice Minister of the Ministry of Trade, Industry and Energy (sixth from the right), Ra Jong-seong, Executive Director of Hanwha Precision Machinery (second from the right), and Jo Jeong-ho, Managing Director (far right), are posing for a commemorative photo after receiving the Presidential Citation at the Machinery, Robot, and Aviation Industry Development Merit Awards held on the 18th at KINTEX in Goyang-si, Gyeonggi-do. Photo by Hanwha Precision Machinery

[Asia Economy Reporter Choi Seoyoon] Hanwha Precision Machinery, an advanced electronic equipment manufacturer under Hanwha Group, announced on the 19th that it received a Presidential Citation in recognition of its success in the domestic development of the multi-head die bonder, a core piece of semiconductor post-process equipment.

Hanwha Precision Machinery's multi-head die bonder contributed to reducing dependence on imported semiconductor equipment and establishing a stable domestic semiconductor industry supply chain through the successful domestic development of an ultra-high-speed, ultra-precision multi-head die bonder.

The company explained, "Hanwha Precision Machinery improved productivity and succeeded in commercialization by overcoming the structural limitations of existing processes and equipment," adding, "It was recognized for proactively preparing for external issues such as Japan's export restrictions, with a parts (material cost) localization rate exceeding 90%."

The die bonder is one of the most challenging core pieces of equipment in the semiconductor post-process packaging stage. 'Die' refers to the semiconductor, and 'bonder' is a machine that precisely bonds the semiconductor and PCB substrate using heat and pressure.

Hanwha Precision Machinery applied the world's first developed automatic correction technology to this die bonder, improving material replacement time and maintaining a high-precision assembly accuracy of 4.2 μm (micrometers, one-millionth of a meter) through individual control of four multi-heads and gantry, achieving more than 2.5 times the actual productivity compared to major overseas competitors.

Ra Jongseong, Executive Director of Hanwha Precision Machinery's Industrial Equipment Division, stated, "We expect the advancement of foundational technology through additional orders for mass production of die bonders, expansion of domestic workforce hiring, and securing stable production volumes for small and medium-sized partner companies," adding, "We will further dedicate ourselves to domestic semiconductor equipment localization and win-win collaboration to contribute to enhancing the value and competitiveness of domestic semiconductor customers."

The Machinery, Robot, and Aerospace Industry Development Merit Award Ceremony is an event hosted by the Korea Machine Industry Promotion Association under the Ministry of Trade, Industry and Energy. Since 1984, it has been held to boost the pride of contributors and companies that have contributed to technology development and commercialization in the capital goods industry, and to strengthen national competitiveness through new market development and job creation. Since 2021, the machinery robot industry and aerospace industry have been integrated and operated under the Machinery, Robot, and Aerospace Industry Development Merit Award.

Image of the multi-head die bonder product from Hanwha Precision Machinery, awarded the Presidential Citation. Photo by Hanwha Precision Machinery

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