[Concall] Samsung Electro-Mechanics "Considering Stepwise Production Capacity Expansion for Package Substrates"
[Asia Economy Reporter Kim Heung-soon] On the 28th, Samsung Electro-Mechanics stated during the Q2 earnings conference call that "to respond to the continuous increase in demand for semiconductor package substrates, we are closely analyzing the supply and demand situation," and "we are considering phased capacity expansions for both BGA and FC-BGA products."
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