Possessing Patent Technology Related to Laser Cutting
POSCO Inter Supports Overseas Expansion and Sales Growth

President Ju Sibo of POSCO International (right) and President Lee Seok-jun of ITI signed a new share subscription agreement for mutual strategic cooperation. (Photo by POSCO International)

President Ju Sibo of POSCO International (right) and President Lee Seok-jun of ITI signed a new share subscription agreement for mutual strategic cooperation. (Photo by POSCO International)

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[Asia Economy Reporter Kim Ji-hee] On the 8th, POSCO International signed a new share subscription agreement with domestic laser technology company ITI at its office in Songdo, Incheon, establishing a strategic cooperation system.


ITI holds a patent for laser thermal shock cutting using ultra-precision laser and optical technologies. Using this technology, it manufactures and sells processing equipment for ultra-thin glass (UTG) used as cover glass in the latest foldable and rollable displays, as well as semiconductor wafer cutting equipment.


Currently, the display market is transitioning to ultra-thin glass materials that can compensate for the weakness of existing transparent polyimide film (CPI) against scratches. The ultra-thin glass component market is expected to grow at an average annual rate of 47%, from 180 billion KRW in 2020 to 1.2 trillion KRW in 2025. Additionally, the global wafer cutting machine market is projected to steadily grow at about 6% annually, from approximately 800 billion KRW last year to 1.1 trillion KRW in 2025.


Although ultra-thin glass and semiconductors at about 30 microns (㎛) thickness are currently being produced, cutting them is very challenging, making high-efficiency mass production difficult with existing technologies. Various post-processing steps are also required after cutting. However, ITI's patented laser thermal shock cutting technology prevents cracks from occurring during the laser cutting stage, eliminating the need for post-processing such as polishing, etching, or residue removal.


Through this cooperation, ITI will establish a high-efficiency and stable processing system for its products, while POSCO International will support ITI's overseas market entry and sales expansion. Both companies also plan to jointly develop related new businesses in the future. This is expected to secure new growth engines such as stable supply to display and semiconductor manufacturers and linkage with upstream and downstream businesses.



A POSCO International official stated, “We have been able to jointly take the lead in the market through investment in a promising market and a strong small and medium enterprise with excellent technology.” He added, “Starting with this investment, we plan to actively practice the corporate citizenship management philosophy that leverages the characteristics of our business by continuously discovering new growth engines and win-win cooperation cases beyond existing business areas.”


This content was produced with the assistance of AI translation services.

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