Hanmi Semiconductor Chairman Dongshin Kwak Completes Acquisition of 3 Billion Won in Treasury Shares

Dongshin Kwak, Chairman of Hanmi Semiconductor, has fulfilled his commitment to acquire 3 billion won worth of treasury shares, as announced last month.

According to a disclosure on the 27th, Chairman Kwak acquired 9,576 common shares of Hanmi Semiconductor at 315,407 won per share on this day. As a result, his ownership stake in Hanmi Semiconductor has increased to 33.57%.

Dongshin Kwak, Chairman of Hanmi Semiconductor

Since 2023, Chairman Kwak has acquired a total of 56.5 billion won worth of treasury shares. The purpose is to demonstrate Hanmi Semiconductor’s technological leadership in the global high-bandwidth memory (HBM) equipment market and to convey confidence in the technological capabilities of the company’s previous TC Bonder and its future growth potential to the market.

Hanmi Semiconductor is the global leader in the market share for TC Bonders used in HBM production, and with mass production of HBM4 (6th generation) ramping up this year, the company is taking the lead in supplying 'TC Bonder 4' to global manufacturers and continuing to secure market leadership.

By the end of this year, the company plans to launch the 'Wide TC Bonder' to support next-generation HBM production. The Wide TC Bonder is specialized equipment for producing next-generation HBM with significantly expanded die area compared to existing HBM, designed to meet the increasing demands for memory capacity and bandwidth in next-generation artificial intelligence (AI) infrastructure.

Additionally, Hanmi Semiconductor is preparing to launch a prototype of the '2nd Generation Hybrid Bonder' within this year, targeting the hybrid bonding market, which is expected to enter full-scale mass production in 2029.

Hybrid Bonding (HCB) is an ultra-precision bonding technology that connects copper to copper directly without the use of 'bumps' (solder protrusions) when stacking semiconductor chips. This allows for a dramatic reduction in overall thickness by minimizing the gap between chips, and greatly improves data transfer speed and heat dissipation performance, making it a recognized 'game changer.'

Hanmi Semiconductor plans to begin full-scale operation of the 'Hybrid Bonder Factory' in the first half of next year, aiming to proactively secure leadership in the next-generation semiconductor packaging market.

A representative from Hanmi Semiconductor stated, "This treasury share acquisition is a strong expression of Chairman Dongshin Kwak’s commitment to responsible management," and added, "As a first mover in the global semiconductor equipment industry, we will achieve sustainable growth."

This content was produced with the assistance of AI translation services.