LS Mtron Participates in 'DesignCon 2026' for Third Consecutive Year... Unveils Wired and Wireless High-Speed Transmission Technologies

All-in-One Smart Antenna Solution for Vehicles Draws Attention
Surge in Inquiries for High-Speed Connectors for AI Data Centers

LS Mtron, an industrial machinery and advanced components specialist under LS Group, announced on March 4 that it showcased its latest technologies and products at the technology exhibition 'DesignCon 2026,' held last month at the Santa Clara Convention Center in California, USA, marking its third consecutive year of participation.

DesignCon, a global technology exhibition with a 30-year history, is held annually in Silicon Valley, California. It brings together approximately 140 global companies from various fields—including IT, semiconductors, and automotive—to share the latest technological trends in components, materials, equipment, and software.

At the LS Mtron booth at DesignCon 2026 held in California, USA. LS Mtron

This year was particularly significant as it marked the 40th anniversary of LS Mtron's electronic components division entering the connector business. On the opening day of the exhibition, February 25 (local time), the company hosted a casual networking program (Beer Crawl) at its booth. Together with visiting customers, LS Mtron celebrated this milestone and enjoyed sharing both its wireless and wired high-speed transmission technologies that strengthen connectivity in the era of artificial intelligence (AI), as well as opportunities for collaboration, all in a relaxed atmosphere.

At this exhibition, LS Mtron unveiled several innovations, including: the world's smallest 0.175-mm pitch board-to-board (B2B) connector, advanced connectivity solutions for hyperscale data centers designed for AI applications, and all-in-one (16-in-One) integrated smart antenna solutions for vehicles such as electric vehicles (EVs) and autonomous cars. Notably, LS Mtron introduced its all-in-one automotive antenna solution for the first time, highlighting its competitiveness in antenna design optimized for future vehicle environments.

In addition, the exhibition focused on showcasing next-generation connector technologies and LS Mtron's strengths in providing customized ODM (original design manufacturing, covering research, development, and production) and OEM (original equipment manufacturing) solutions. Last year, LS Mtron demonstrated its technological capabilities by successfully collaborating with global connector manufacturers throughout the design-to-production process in the ODM and OEM connector sector.

Song Indeok, Head of LS Mtron's Electronic Components Division, stated, "The core of the AI era is high-speed transmission, integration, and miniaturization. By combining our expertise in miniaturization with high-speed transmission technology, we will continue to introduce small yet fast, high-performance connectivity solutions that our customers can rely on, enabling us to grow together with them."

This content was produced with the assistance of AI translation services.