LG Electronics Partners with Flex to Develop Modular Data Center Cooling Solution

MOU Signed for Joint Development of Modular Cooling Solution
LG Electronics' High-Efficiency Cooling Products, Including Chillers and CDUs
Combined with Flex's IT and Power Infrastructure
Modular Cooling Solution: Pre-Assembled and Tested Design<

On November 4, LG Electronics announced that it has signed a memorandum of understanding (MOU) with Flex, a global data center infrastructure company, to jointly develop a "modular cooling solution" aimed at addressing the overheating issues in artificial intelligence (AI) data centers. The company also stated that it will diversify the application methods and use cases for the cooling solution.

LG Electronics, Flex Logo. LG Electronics

The two companies plan to combine LG Electronics' high-efficiency cooling products-such as chillers, coolant distribution units (CDUs), and computer room air handlers (CRAHs) that regulate temperature and humidity within data centers-with Flex's IT and power infrastructure to develop a modular data center cooling solution.

This solution is designed with a module-based structure to maximize the scalability and flexibility of data center infrastructure. It is manufactured as pre-assembled and tested cooling modules that can be integrated with other modules on-site. The structure allows for easy expansion with additional cooling modules as needed to efficiently manage heat loads generated in high-density computing environments. Furthermore, it can be customized to meet the thermal management requirements of each data center and enables rapid deployment and installation, setting it apart from conventional cooling solutions.

Through this collaboration, both companies expect to streamline the data center construction process and deliver innovative, scalable data center infrastructure to customers, thereby realizing differentiated customer value.

Flex is a global company that provides comprehensive solutions-including design, development, manufacturing, supply chain management, and after-sales service-to clients in a wide range of industries such as data centers, automotive, healthcare, and telecommunications. The company is a leader in the electronics manufacturing services (EMS) sector and was named one of the "World's Best Companies" by TIME magazine this year.

LG Electronics is establishing itself as a leading provider of optimal cooling solutions for data centers, leveraging its comprehensive cooling technologies that encompass both air and liquid cooling. Recently, the company developed a new coolant distribution unit with more than twice the cooling capacity of its predecessors and added immersion cooling-which boasts the lowest power usage effectiveness (PUE) among data center cooling methods-to its portfolio.

Michael Hartung, President and Chief Commercial Officer at Flex, said, "By collaborating with LG Electronics, we will provide customers with the optimal cooling solutions to address the thermal challenges of data centers." Lee Jaesung, Executive Vice President and Head of the ES Business Division at LG Electronics, stated, "Our collaboration with Flex is more than a simple partnership; it is a strategic opportunity to deliver innovative and differentiated value to customers while strengthening LG Electronics' position in the AI data center market."

This content was produced with the assistance of AI translation services.