Chiwon Hwang of Samsung Electro-Mechanics Receives Presidential Commendation at 20th Electronics·IT Day

Localization of High-Performance Semiconductor Package Substrates
Recognized for Advancing Global Technological Competitiveness

Samsung Electro-Mechanics announced that Chiwon Hwang, Executive Director and Head of the Package Development Team, received the Presidential Commendation at the 20th Electronics·IT Day awards ceremony held on October 21. This recognition is attributed to his contributions over approximately 20 years in leading advanced technology development and enhancing global competitiveness in the semiconductor package substrate sector.

Chiwon Hwang, Executive Director at Samsung Electro-Mechanics. Samsung Electro-Mechanics

Since joining Samsung Electro-Mechanics in 2011, Executive Director Hwang has spearheaded the development of future-oriented advanced technologies and manufacturing techniques for package substrates, a core area in semiconductor packaging. He has played a pivotal role in achieving technological self-reliance for Korea’s substrate industry and strengthening its global market competitiveness.

Notably, he led the development of high-performance semiconductor package substrates for servers, enabling Samsung Electro-Mechanics to begin mass production and supply to major global clients starting in 2022-a first in Korea. He also secured new package substrate structures that realize both power efficiency and high performance, as well as yield improvement technologies, achieving both technological differentiation and enhanced cost and quality competitiveness.

Furthermore, he pioneered the world’s first mass production of next-generation semiconductor package substrates, including coreless substrates, Si-cap embedded substrates, and packages for ARM-based CPUs. He is leading the development of next-generation SoS technologies and products targeting future growth markets such as AI, cloud, and automotive electronics. As a result, Samsung Electro-Mechanics’ semiconductor package substrate business has attained global top-tier technological and market competitiveness.

Currently, Executive Director Hwang is also contributing to strengthening global customer responsiveness and production competitiveness by expanding new production facilities with Busan as the development hub. Moving forward, the company plans to further solidify its technological leadership in line with the rapid growth of the high-performance semiconductor package substrate market.

Executive Director Hwang stated, “It is deeply meaningful that this award demonstrates the technological capabilities of Samsung Electro-Mechanics in semiconductor package substrate development. We will continue to lead the way in high-performance semiconductor package substrate technology, which will become core infrastructure for future industries such as AI, cloud, and automotive electronics.”

Meanwhile, Electronics·IT Day was established in 2005 to commemorate surpassing 100 billion dollars in exports in the electronics·IT sector. On this day, individuals who have contributed to the advancement of the electronics·IT industry and the nation’s status are honored with industrial medals, industrial service medals, Presidential Commendations, Prime Minister’s Commendations, and Ministerial Commendations.

This content was produced with the assistance of AI translation services.