Hanmi Semiconductor Wins 10.8 Billion KRW Manufacturing Equipment Order from SK Hynix
Hanmi Semiconductor announced on the 14th that it has signed a contract with SK Hynix for equipment orders worth approximately 10.8 billion KRW for manufacturing high-bandwidth memory (HBM).
Hot Picks Today
"Stocks Are Not Taxed, but Annual Crypto Gains Over 2.5 Million Won to Be Taxed Next Year... Investors Push Back"
- "Not Jealous of Winning the Lottery"... Entire Village Stunned as 200 Million Won Jackpot of Wild Ginseng Cluster Discovered at Jirisan
- Bull Market End Signal? Securities Firm Warns: "Sell SK hynix 'At This Moment'"
- "Looks Even More Like Him in Person": Albino Water Buffalo with Golden Hair and Pink Skin Nicknamed 'Trump'
- "Even With a 90 Million Won Salary and Bonuses, It Doesn’t Feel Like Much"... A Latecomer Rookie Who Beat 70 to 1 Odds [Scientists Are Disappearing] ③
This amount corresponds to 6.8% of the 2023 sales revenue, and the contract period lasts until July 1. The equipment ordered this time is known as a TC bonder for SK Hynix's mass production of the HBM3E (5th generation) 12-stack product. The TC bonder is a core manufacturing device for HBM used in artificial intelligence (AI) semiconductors and is Hanmi Semiconductor's flagship product.
This content was produced with the assistance of AI translation services.
© The Asia Business Daily(www.asiae.co.kr). All rights reserved.
