Hanmi Semiconductor Wins 10.8 Billion KRW Manufacturing Equipment Order from SK Hynix
Hanmi Semiconductor announced on the 14th that it has signed a contract with SK Hynix for equipment orders worth approximately 10.8 billion KRW for manufacturing high-bandwidth memory (HBM).
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This amount corresponds to 6.8% of the 2023 sales revenue, and the contract period lasts until July 1. The equipment ordered this time is known as a TC bonder for SK Hynix's mass production of the HBM3E (5th generation) 12-stack product. The TC bonder is a core manufacturing device for HBM used in artificial intelligence (AI) semiconductors and is Hanmi Semiconductor's flagship product.
This content was produced with the assistance of AI translation services.
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