SK Hynix participates in TSMC-hosted 'OIP 2024'... "HBM joint research presentation"

Held on the 25th at Santa Clara Convention Center, USA
Exhibition of latest AI memory including HBM3E
Technology presentations by Nvidia, AMD, and others

SK Hynix will participate in the 'Open Innovation Platform (OIP) Forum' hosted by Taiwan's TSMC, the world's largest foundry (semiconductor contract manufacturing) company, to showcase its artificial intelligence (AI) memory solutions. They will also present jointly researched content with TSMC.

SK Hynix Icheon Headquarters
[Image source=Yonhap News]

According to industry sources on the 20th, TSMC will hold the 'OIP Ecosystem Forum 2024' on the 25th (local time) at the Santa Clara Convention Center in California, USA, to discuss the latest technologies and products with partners and customers.

This event highlights the network that TSMC has built. Since 2008, TSMC has been developing the OIP together with intellectual property (IP) companies, electronic design automation (EDA) companies, and design houses, supporting fabless companies with semiconductor designs optimized for TSMC’s manufacturing processes. At this year’s event, TSMC will introduce how AI is transforming chip design and the latest advancements in three-dimensional (3D) integrated circuit (IC) system design. Additionally, there will be more than 50 technical presentations and an exhibition featuring 47 OIP ecosystem partners.

Among them, SK Hynix will present on the '2.5D system in package for improving the quality and reliability of high-bandwidth memory (HBM)' which has been jointly researched with TSMC. SK Hynix has established a cooperative relationship with TSMC and has conducted various studies related to HBM. Furthermore, SK Hynix will set up a booth exhibiting the latest AI memory products including the 5th generation HBM, HBM3E, LPCAMM2, and GDDR7. In addition, companies such as NVIDIA, Microsoft, AMD, Arm, Cadence, and Synopsys will also deliver technical presentations.

The OIP Forum will be held in six regions including the United States, Japan (October), Taiwan, China, Europe, and Israel (November), with a total of 750 companies and over 6,000 participants expected to attend.

This content was produced with the assistance of AI translation services.