'Next-Generation Semiconductor Packaging Industry Expo' to be Held in Suwon in August

Poster for the Next-Generation Semiconductor Packaging Industry Exhibition hosted by Gyeonggi Province

The next-generation semiconductor packaging industry exhibition will be held in Suwon, Gyeonggi Province this August.

Gyeonggi Province announced on the 31st that, in cooperation with Suwon City, it will hold the "2024 Next-Generation Semiconductor Packaging Industry Exhibition" at the Suwon Convention Center from August 28 to 30, and is recruiting participating companies until August 27.

This industry exhibition, specializing in semiconductor back-end processes, is the second event following last year. This year, over 150 companies and organizations will participate, showcasing a variety of items related to semiconductor packaging, including ▲testing, assembly, bonding equipment ▲materials and components ▲advanced technology solutions.

This year's exhibition is organized with beneficial programs for visitors over three days, including the International Semiconductor Packaging Forum, technical seminars by participating companies, a purchasing consultation meeting for domestic companies, and a job fair.

In particular, this year, overseas companies related to semiconductor packaging such as ASM Pacific Technology Hong Kong Limited (ASMPT) and Resonac, along with key speakers from major domestic corporations, will participate to introduce the latest trends and technological developments in semiconductor packaging at the "Semiconductor Packaging Trend Forum," held on the first day of the exhibition.

Gyeonggi Province is accepting online pre-registrations for the "2024 Next-Generation Semiconductor Packaging Industry Exhibition" on the official website (https://www.semipkgshow.com/) until August 27.

Meanwhile, last year's event featured 91 companies and organizations with 276 booths, attracting 8,296 visitors to the venue.

This content was produced with the assistance of AI translation services.