[Click eStock] "Hanmi Semiconductor, Steady Orders for HBM TC Bonder... 1 Trillion KRW Sales Expected Next Year"

Hyundai Motor Securities forecasted on the 10th that "Hanmi Semiconductor will easily achieve sales of 1 trillion won next year, supported by continuous orders for HBM (High Bandwidth Memory) 'TC Bonders'."

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Minjung Kwak, an analyst at Hyundai Motor Securities, stated in a report on the same day, "Hanmi Semiconductor received an order worth 150 billion won last week from SK Hynix for the ‘Dual TC Bonder Griffin’," adding, "The cumulative orders for TC Bonders from SK Hynix have reached 358.7 billion won."

A TC Bonder is equipment that vertically stacks chips on a circuit board using a thermal compression bonding method. Demand is rapidly increasing as it is used for vertical stacking packaging of HBM. The Dual TC Bonder produced by Hanmi Semiconductor applies an ultra-high-speed dual method, significantly improving HBM production efficiency compared to existing TC Bonders.

Analyst Kwak said, "Hanmi Semiconductor plans to expand its TC Bonder production capacity (CAPA) from 22 units per month this year to about 35 units per month next year to meet growing demand," and predicted, "With this order from SK Hynix, it will easily achieve sales of 1 trillion won next year."

He emphasized, "Hanmi Semiconductor is the only company worldwide capable of manufacturing vibration-controlled Dual TC Bonder equipment for HBM," and added, "Based on technological superiority and the continuous release of new equipment, the order rally will continue."

This content was produced with the assistance of AI translation services.