[Special Stock] GoYoung Rises on Growth Outlook with On-Device AI and HBM Semiconductor Inspection Equipment

Goyoung is showing strong performance. It is interpreted that this is due to expectations in the securities industry that inspection demand for various targets such as on-device artificial intelligence (AI) and high-bandwidth memory (HBM) will expand.

As of 9:56 AM on the 11th, Goyoung is trading at 12,570 KRW, up 11.24% compared to the previous day.

Lee Sangheon, a researcher at Hi Investment & Securities, stated in a report on the same day, "The wafer-level package (WLP) method can reduce manufacturing costs compared to existing methods, and it can also improve productivity and heat dissipation functions, so it is being used increasingly in a wide range of areas including on-device AI." He added, "If Goyoung's WLP process inspection solution, the Meister W series, is introduced to the mass production lines of global semiconductor customers in the second half of this year, inspection demand will expand as on-device AI and others become full-fledged, benefiting the company."

The researcher also analyzed, "On the other hand, as demand for high-performance semiconductors that realize the high computing power required by generative AI such as Chat GPT and large language models (LLM) increases, demand for 2.5D packaging, chip-on-wafer-on-substrate (CoWoS), is also rising." He noted, "Goyoung has secured global semiconductor customers related to CoWoS."

He said, "Global semiconductor companies are promoting the establishment of advanced packaging lines to expand HBM supply as the AI market grows." He added, "As inspection demand for various semiconductor targets increases in the future, Goyoung is expected to benefit."

This content was produced with the assistance of AI translation services.