Hanmi Semiconductor Develops Essential Equipment for Next-Gen HBM... "Scheduled for Delivery to Global Semiconductor Companies"
Hanmi Semiconductor, a semiconductor equipment company, announced on the 19th that it will supply the global semiconductor industry with the third-generation hyper model "DUAL TC BONDER GRIFFIN," an essential process equipment for next-generation high-bandwidth memory (HBM) used in artificial intelligence (AI) semiconductors.
Kwack Dong-shin, Vice Chairman of Hanmi Semiconductor, stated, "The newly introduced 'DUAL TC BONDER GRIFFIN' is a third-generation hyper model equipped with the latest technology, a bonding device that stacks semiconductor chips made using TSV technology onto wafers." He added, "It features significantly improved productivity and precision for semiconductor chip stacking, essential for next-generation HBM production." He further noted, "In the future, the dual TC bonders, including the hyper model Griffin and the premium model Dragon, will be sold according to customer needs and specifications, and are expected to contribute significantly to next year's sales."
Kwack Dong-shin, the largest shareholder of Hanmi Semiconductor, has increased his stake to 35.75% by investing a total of 12.4 billion KRW and purchasing 232,300 shares since the fourth week of July. This investment is analyzed to be driven by confidence in the company's future, fueled by the growth of the AI market and the continuous launch of new equipment for HBM.
Hanmi Semiconductor has filed 106 patents (including pending applications) related to bonding equipment. Based on this, the company is expected to strengthen its competitive edge with outstanding technology and durability.
Hot Picks Today
"Buy on Black Monday"... Japan's Nomura Forecasts 590,000 for Samsung, 4 Million for SK hynix
- "Plunged During the War, Now Surging Again"... The Real Reason Behind the 6% One-Day Silver Market Rally [Weekend Money]
- "Not Everyone Can Afford This: Inside the World of the True Top 0.1% [Luxury World]"
- "We're Now Earning 10 Million Won a Month"... Semiconductor Boom Drives Performance Bonuses at Major Electronic Component Firms
- Experts Are Already Watching Closely..."Target Stock Price 970,000 Won" Now Only the Uptrend Remains [Weekend Money]
Founded in 1980, Hanmi Semiconductor participated as an official sponsor at 'SEMICON Taiwan' held in Taipei, Taiwan, on the 6th. The company showcased the 'TC BONDER CW (Thermo-Compressor Bonder Chip to Wafer),' a 2.5D package type applicable to TSMC's 'CoWoS (Chip on Wafer on Substrate) package,' and continues active global marketing activities with related clients such as ASE, Amkor, and SPIL.
© The Asia Business Daily(www.asiae.co.kr). All rights reserved.