Hanmi Semiconductor "Essential Equipment Sales Expected to Increase 10-Fold with HBM Growth"

SK Hynix Supplies Dual TC Bonders Worth 41.6 Billion KRW

Hanmi Semiconductor announced on the 1st that it received its largest-ever order of 41.6 billion KRW from SK Hynix for the essential process equipment for high-bandwidth memory (HBM) used in artificial intelligence (AI) semiconductors, the ‘Dual TC Bonder 1.0 Dragon.’

In an interview with Asia Economy, Dongshin Kwak, Vice Chairman and CEO of Hanmi Semiconductor, said, “The second-generation Dual TC Bonder 1.0 Dragon, which we secured in a large-scale order this time, is an advanced bonding equipment for AI HBM production, and the growth of HBM is just beginning.”

He continued, “NVIDIA, leading the AI semiconductor market, announced results on the 23rd of last month that far exceeded market expectations, creating the highest level of anticipation,” adding, “Its current stock price is $493.55, with a market capitalization surpassing 1,600 trillion KRW.”

CEO Kwak emphasized, “Wall Street evaluates that the price-to-earnings ratio (PER) is only 28 times next year’s earnings, indicating ample room for growth,” and “The target price is set at $1,100, double the current price, with today being considered the cheapest time to buy.” He introduced, “Hanmi Semiconductor’s Dual TC Bonder sales related to HBM are expected to grow more than tenfold in 2024 compared to this year,” and “Following the launch of the second-generation Dual TC Bonder last week, we are preparing to release advanced equipment compatible with the latest HBM chips in the future.”

He added, “Through an expansion related to the Dual TC Bonder worth approximately 300 billion KRW, we are ready to grow alongside the expansion of the AI semiconductor market.”

Hanmi Semiconductor is the second-largest shareholder of HPSP, holding 16.71% of the shares (Hanmi Semiconductor 9.74%, Dongshin Kwak 6.97%). The company invested when HPSP’s corporate value was 300 billion KRW and the stock price was 4,527 KRW per share in 2021. Based on the closing price of 32,700 KRW the previous day, with a market capitalization of 2.6539 trillion KRW, it has recorded an evaluation gain of 450 billion KRW. Regarding the secret to successful investment, he said, “Stock investment is simple,” and “It is about long-term investment in future IT growth companies.”

Founded in 1980, Hanmi Semiconductor will showcase the ‘TC Bonder CW (Thermo-Compressor Bonder Chip to Wafer),’ a 2.5D package type applicable to TSMC’s ‘CoWoS (Chip on Wafer on Substrate) package,’ at the Semicon Taiwan exhibition held in Taipei, Taiwan, on the 6th. The company plans to actively conduct global marketing activities with related customers such as ASE, Amkor, and SPIL.

This content was produced with the assistance of AI translation services.