Samsung Electro-Mechanics Hosts 'Welcome Day' Inviting Over 40 Pohang University of Science and Technology Professors and Students
Held at Busan Plant on April 28... Industry-Academia Cooperation in Materials and Components
Introduction to Advanced MLCC and Package Substrate Technologies, Tour of Core Processes
Samsung Electro-Mechanics announced on the 1st that it hosted the 'Next-Generation Materials and Components Development Talent Welcome Day' by inviting over 40 professors and students from the Department of Materials Science and Engineering at Pohang University of Science and Technology (POSTECH) to its Busan plant on the 28th of last month.
The event was a follow-up to the 'Samsung Electro-Mechanics-POSTECH Materials and Components Talent Development Business Agreement (MOU)' signed at POSTECH in November last year. It was organized to expand industry-academia cooperation.
Professors and students from POSTECH received explanations about advanced technologies such as Samsung Electro-Mechanics' multilayer ceramic capacitors (MLCC) and semiconductor package substrates at the Busan plant. They also toured the core MLCC process facilities.
A commemorative photo taken at Samsung Electro-Mechanics' 'Next-Generation Materials and Components Development Talent Welcome Day' held on the 28th of last month at the Busan plant. About 40 professors and students from the Department of Materials Science and Engineering at Pohang University of Science and Technology were invited.
[Photo by Samsung Electro-Mechanics]
Samsung Electro-Mechanics reported that POSTECH students were amazed by the cleanroom. The cleanroom is managed to prevent foreign substances smaller than 1um (micrometer), which is smaller than fine dust, from entering a 30cm by 30cm cubic space.
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Samsung Electro-Mechanics stated that it is focusing its capabilities on nurturing and securing specialized talent in materials and components. Last year, it signed an MOU with POSTECH for talent development linked to recruitment, operating customized education programs and researching projects related to materials and components. It is conducting nine projects with POSTECH, including element technologies related to MLCC and semiconductor package substrates.
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