Hanmi Semiconductor Unveils 'Wafer Micro Saw' at SEMICON Taiwan Exhibition

[Asia Economy Reporter Hyungsoo Park] Semiconductor equipment company Hanmi Semiconductor announced on the 14th that it has developed the 'Full Automation Wafer Micro SAW W1121,' a wafer cutting saw (SAW) equipment, and will unveil it at the '2022 SEMICON Taiwan Exhibition.'

Hanmi Semiconductor's CEO, Vice Chairman Dongshin Kwak, introduced, "The Wafer Micro SAW is a fully automated standalone 12-inch wafer saw equipment that cuts wafers attached to wafer rings or tape in semiconductor manufacturing processes."

He added, "Based on over 42 years of Hanmi Semiconductor's experience and know-how, we developed this by integrating precision machining, vision, and setting technologies. We have improved productivity and precision compared to competitors and significantly enhanced user convenience features."

Vice Chairman Kwak emphasized, "With confidence in quality, we provide a standard 2-year warranty on all Micro SAW equipment. We expect to generate new sales through Micro SAW equipment going forward."

Hanmi Semiconductor also developed the Micro SAW Blade, which will be showcased at SEMICON Taiwan.

In June last year, Hanmi Semiconductor succeeded in domestic production of the dual-chuck Micro SAW. It has consecutively launched the 20-inch Micro SAW for jumbo PCBs, 12-inch Micro SAW, tape Micro SAW, and glass Micro SAW. The Wafer Micro SAW is the sixth saw equipment released by Hanmi Semiconductor.

The '2022 SEMICON Taiwan Exhibition,' held at Nangang Exhibition Center in Taipei, Taiwan, is a leading industrial exhibition representing the semiconductor equipment and materials sectors. Over 700 major global semiconductor companies, including TSMC, Applied Materials, Tokyo Electron, and ASE, the world's largest OSAT company, participate.

This content was produced with the assistance of AI translation services.