Samsung Electro-Mechanics Showcases Semiconductor Substrate Technology at Korea's Largest 'Circuit Board Exhibition'

Exhibition of High-Performance, High-Density, Ultra-Slim Advanced Semiconductor Package Substrates for 5G, AI, and Automotive Applications

Samsung Electro-Mechanics Exhibition Booth [Photo by Samsung Electro-Mechanics]

[Asia Economy Reporter Kim Heung-soon] Samsung Electro-Mechanics announced on the 6th that it will showcase its semiconductor substrate technology at the 'International Printed Circuit and Assembly Industry Exhibition (KPCA show 2021)' held at Songdo Convensia until the 8th.

Semiconductor package substrates are products that connect highly integrated semiconductor chips and mainboards (substrates) to transmit electrical signals and power. Due to the high performance of semiconductors for 5G, artificial intelligence (AI), and automotive applications, the number of substrate layers is increasing, requiring advanced technologies such as fine circuit implementation, fine interlayer alignment, and slimming to reduce set thickness.

At this exhibition, which is attended by domestic and international substrate, material, and equipment companies, Samsung Electro-Mechanics will display high-performance FCBGA. FCBGA is a highly integrated package substrate that connects semiconductor chips and package substrates with flip-chip bumps, enhancing electrical and thermal characteristics. It is a high-spec product mainly used in CPUs (Central Processing Units) and GPUs (Graphics Processing Units), which exchange many electrical signals.

They will also introduce ultra-small, high-density semiconductor substrates for mobile and IT applications. Additionally, they will exhibit FCCSP (Flip-Chip Chip Scale Package), which reduces thickness by 40% compared to existing products and can be applied to ultra-slim APs (Application Processors), and SiP (System in Package), which embeds multiple semiconductor chips and passive components such as MLCCs (Multi-Layer Ceramic Capacitors) within the package substrate.

Meanwhile, Hwang Chi-won, Group Leader of the Substrate Development Team at Samsung Electro-Mechanics, will receive the 'PCB Industry Award' for his contribution to developing high-performance computer semiconductor package substrates. High-performance computer semiconductor package substrates require very advanced technologies such as circuit miniaturization, high multilayering, and large-area substrates. Group Leader Hwang will present 'Market and Technology Trends of Semiconductor Package Substrates' at the KPCA International Symposium.

This content was produced with the assistance of AI translation services.