Lee Jae-yong: "No Time to Hesitate, Must Seize Opportunities Post-COVID"

The appearance of Vice Chairman Lee Jae-yong visiting Samsung Electronics Onyang Plant on the 30th to review the next-generation semiconductor packaging technology development strategy (Photo by Samsung Electronics)

[Asia Economy Reporter Changhwan Lee] Samsung Electronics Vice Chairman Lee Jae-yong visited the Onyang plant to inspect next-generation semiconductor packaging technology.

Samsung Electronics announced that on the 30th, Vice Chairman Lee visited the Onyang plant to review the mid- to long-term strategy, including the roadmap for next-generation semiconductor packaging technology development, and held a meeting to encourage employees.

This is Vice Chairman Lee's second visit to the Onyang plant since August last year. On this day, he focused on next-generation packaging technologies used in future semiconductor production such as AI (Artificial Intelligence) and 5G (fifth-generation) communication modules, and high-bandwidth memory (HBM), urging the development of innovative technologies to strengthen competitiveness.

Packaging refers to the technology of encapsulating semiconductor chips in a form that allows semiconductor wafers with circuits to communicate signals with electronic devices. Next-generation packaging technology development is being carried out at the Onyang plant.

Recently, with the spread of AI, 5G mobile communications, and the Internet of Things, demand for high-performance, high-capacity, low-power, and ultra-compact semiconductors has increased, making packaging technology a core next-generation semiconductor technology to enhance semiconductor performance and production efficiency.

Vice Chairman Lee said, "We must seize the post-COVID future, and there is no time to hesitate. We must take on challenges to leap forward and continuously innovate."

Attendees included Samsung Electronics Vice Chairman Kim Ki-nam, President Jin Gyo-young of the Memory Business Division, President Jung Eun-seung of the Foundry Business Division, President Kang In-yeop of the System LSI Business Division, and President Park Hak-gyu of the Management Support Office.

Samsung Electronics integrated its packaging manufacturing and research organizations at the end of 2018 to establish the TSP (Test & System Package) general organization, and in 2019, acquired Samsung Electro-Mechanics' PLP (Panel Level Package) business division, strengthening its next-generation packaging capabilities.

This content was produced with the assistance of AI translation services.