SK Hynix Publishes 'Package and Test' Book... Expanding Semiconductor Knowledge Sharing

'Package and Test' published by SK Hynix

[Photo by SK Hynix]

[Asia Economy Reporter Ki-min Lee] SK Hynix has published a book to share accumulated expertise and experience while operating the knowledge-sharing platform 'Semiconductor Academy' for its partners.

On the 10th, SK Hynix announced the publication of the book titled "Package and Test to Increase the Added Value of Semiconductors." In the semiconductor manufacturing process, 'package' refers to the process of packaging semiconductors to protect them from external shocks or to create composite products, and 'test' is the stage of electrically inspecting semiconductor chips to identify defects.

This book contains fundamental theories of the package and test processes and comprehensive knowledge about semiconductor chip package production. In particular, to help readers easily understand semiconductor expertise, the key points at the end of each chapter are summarized in comics.

SK Hynix explained that this book is expected to help improve the capabilities of partner companies struggling to enhance their semiconductor technical skills, as well as students entering the semiconductor industry and related industry workers.

Additionally, SK Hynix stated that all proceeds from sales will be reinvested to expand knowledge sharing and strengthen win-win cooperation with partners, including the production of semiconductor content for partner members.

The book was primarily written by Min-seok Seo, team leader of the WLP (Wafer Level Package) Process Management Team at SK Hynix, who has participated in package development and mass production for over 20 years.

Meanwhile, to strengthen the semiconductor ecosystem, SK Hynix has been operating the 'Semiconductor Academy,' which provides technical education to partners as part of infrastructure sharing since 2018, and the 'Analysis and Measurement Support Center,' which shares production equipment and analysis capabilities with partners.

SK Hynix plans to publish additional books in a series covering the front-end semiconductor processes to further expand the scope of knowledge sharing for strengthening the semiconductor ecosystem.

Team Leader Minseok Seo (left), author of "Package and Test," and planner Sangik Lee, SV Biz Model Team TL

[Photo by SK Hynix]

This content was produced with the assistance of AI translation services.