DB HiTek to Participate in Europe's "PCIM 2026" ... Showcasing Latest Power Semiconductor Technologies

Participation in Europe’s Largest Power Semiconductor Exhibition

First Participation Last Year, Follow-up Commercialization Underway

Latest Developments in Next-generation Power Semiconductors Unveiled

DB HiTek will accelerate its expansion into the European market by participating in "PCIM (Power Conversion and Intelligent Motion) 2026," Europe's largest power semiconductor exhibition, which will be held in Nuremberg, Germany from June 9 to 11 (local time).

DB HiTek participated in PCIM for the first time last year, holding face-to-face meetings with dozens of client companies, introducing technologies for key processes, and discussing potential collaborations. According to the company, more than 1,000 visitors stopped by its booth, and with follow-up commercialization efforts with last year’s client companies now underway, DB HiTek expects to generate tangible results starting this year.

At this year’s exhibition, DB HiTek will share the latest development status of its SiC (silicon carbide) and GaN (gallium nitride) processes, which are gaining attention as next-generation power semiconductors. The company also plans to showcase its BCDMOS (Bipolar-CMOS-DMOS) process, which is recognized as having industry-leading technical capabilities. In addition, various meetings with client companies are scheduled.

DB HiTek headquarters located in Bucheon, Gyeonggi Province. DB HiTek

According to Yole Développement, a market research firm specializing in semiconductors and electronics, the global SiC and GaN power semiconductor markets are expected to experience rapid growth. The SiC market is projected to grow from approximately $4.8 billion in 2026 to about $10.4 billion in 2030, with an average annual growth rate of about 21%. During the same period, the GaN market is expected to expand from around $900 million in 2026 to approximately $2.9 billion in 2030, achieving an average annual growth rate of about 33%.

In December 2025, DB HiTek conducted MPW (Multi-Project Wafer) production based on SiC and GaN processes, manufacturing products for more than 10 client companies each, and delivered them to customers between March and April 2026. Customer evaluations are currently in progress, and the company plans to finalize its processes based on this feedback. Mass production of SiC and GaN processes is scheduled to begin in earnest in 2027.

DB HiTek is currently engaged in mass production of its main product, power semiconductors, with about 400 client companies. In addition, the company is collaborating with a wide range of customers based on its specialized image sensor process technologies, such as X-ray, global shutter, and SPAD (single-photon avalanche diode). The proportion of industrial and automotive products among its applied products continues to increase.

This content was produced with the assistance of AI translation services.