SK hynix: Next-Gen "HBM4E" to Begin Mass Production in 2027, Aiming for Sample Supply in Second Half of This Year

On April 23, during its first quarter earnings conference call, SK hynix stated that it is preparing for HBM4E (High Bandwidth Memory 4E) through close collaboration with its customers regarding the schedule and product specifications. The company added that development is progressing smoothly, with internal plans to supply samples in the second half of this year and to begin mass production in 2027.

They further explained, "The base die to be used for HBM4E is being developed based on the optimal technology to meet customer performance requirements, and the core die will adopt the 1c process to respond to higher customer performance demands," adding, "Through these efforts, we expect to provide customers with HBM4E products that ensure both reliable performance and sufficient supply."

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