Samsung President Song Jaehyuk: "We Lead in HBM4 Technology... Showing Our Original Self"
First HBM4 Shipment to Nvidia This Month
"Customer Feedback Has Been Very Satisfactory"
"Samsung's Memory and Foundry Holdings Create Synergies"
Song Jaehyuk, President and Chief Technology Officer (CTO) of the Device Solutions (DS) Division at Samsung Electronics, expressed confidence about the sixth-generation High Bandwidth Memory (HBM4), which is scheduled to be shipped to Nvidia for the first time this month, saying, "We are now showing you our original self."
Meeting with reporters before delivering his keynote speech at the "Semicon Korea 2026" event held at COEX in Gangnam-gu, Seoul on the 11th, President Song said, "For a while, we were not able to show Samsung responding with the world's best technology that customers had demanded," and made these remarks. When asked about feedback from customers such as Nvidia, he repeatedly answered, "They are very satisfied."
According to the industry, Samsung Electronics will begin mass-production shipments of HBM4, which will be mounted on Nvidia's next-generation AI (artificial intelligence) chip "Vera Rubin," as early as the third week of this month.
President Song stressed that the company's HBM4 products are "the best in terms of technology." However, he avoided giving immediate answers to specific questions regarding market share, shipment volume, and yield related to future HBM4 supply, saying those matters concerned its customers.
He went on to explain that the company is generating synergies, saying, "Having both memory and foundry under one roof provides the best environment for developing products that meet AI-driven demand." He predicted that chip supply shortages caused by the surge in AI demand will continue until next year.
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Regarding future product development such as HBM4E and HBM5 (eighth generation), he said, "We are preparing to demonstrate them with strong technological capabilities."
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