Hanmi Semiconductor Wins 300 Million Dollar Export Tower

On December 4, Hanmi Semiconductor was awarded the "300 Million Dollar Export Tower" at the 62nd Trade Day ceremony held at COEX in Gangnam-gu, Seoul. This award recognizes Hanmi Semiconductor's technological prowess in semiconductor equipment, including TC Bonders for high bandwidth memory (HBM), in the global market.

The Export Tower is an award presented by the Korea International Trade Association and the Ministry of Trade, Industry and Energy to companies that have contributed to pioneering overseas markets and increasing exports. Recipients are selected based on their export performance over a one-year period, from July 1 of last year to June 30 of this year.

Hanmi Semiconductor previously won the "100 Million Dollar Export Tower" in 2011 and the "200 Million Dollar Export Tower" in 2021. This year, by winning the "300 Million Dollar Export Tower," the company has further accelerated its growth. Hanmi Semiconductor demonstrated steep growth, reaching the 300 million dollar mark from 200 million dollars in just four years.

Founded in 1980, Hanmi Semiconductor is a semiconductor equipment manufacturer with more than 320 clients worldwide. Over the past decade, the company's overseas sales have accounted for an average of about 70% of total revenue, demonstrating strong competitiveness in the global market.

The key equipment driving Hanmi Semiconductor's recent export growth is the TC Bonder, which is essential for HBM production. Currently, Hanmi Semiconductor holds the number one global market share in HBM TC Bonders, a core component for AI semiconductors. Since 2002, the company has focused on strengthening its intellectual property rights, and to date, it has filed 130 patents related to HBM equipment, continuously expanding its technological competitiveness.

Hanmi Semiconductor is also expected to lead the market next year by supplying "TC Bonder 4" equipment for HBM4, which major memory manufacturers around the world are preparing to mass-produce. "TC Bonder 4" was launched in May and established a mass production system in July.

Additionally, Hanmi Semiconductor has maintained its unrivaled technological competitiveness in the Micro Saw Vision Placement (MSVP) market, holding the number one global position for 21 consecutive years since 2004. MSVP is essential equipment in the semiconductor manufacturing process, performing cutting, cleaning, drying, inspection, sorting, and stacking of semiconductor packages.

Hanmi Semiconductor Chairman Kwak Dongshin stated, "Winning the 300 Million Dollar Export Tower is a result of Hanmi Semiconductor's technological capabilities being recognized in the global market alongside the growth of the HBM market." He added, "I would like to express my gratitude to Sanjay Mehrotra, Chairman of Micron Technology in the United States, for his trust in Hanmi Semiconductor." He continued, "We will continue to contribute to the growth of Korea's semiconductor industry through ongoing technological innovation and strengthening of our global network."

This content was produced with the assistance of AI translation services.