[Click eStock] "Hanmi Semiconductor, Time to Focus on Bonding Market Growth"

DS Investment & Securities analyzed on the 13th that it is time to pay attention to the growth of the bonding market for Hanmi Semiconductor.

Lee Su-rim, a researcher at DS Investment & Securities, explained, "The TC bonder for the current largest customer in the 4th quarter of this year is understood to be smoothly shipped according to the supply schedule of the end users of artificial intelligence (AI) accelerators."

He added, "There are market concerns about the reduction of Hanmi Semiconductor's volume due to the largest customer's intention to diversify TC bonders, but the concerns at this point are excessive."

He emphasized, "Considering Hanmi Semiconductor's reference, which exclusively received large-scale orders for TC bonders for HBM, as the market share leader, it will continue to be the primary supplier."

The researcher analyzed, "The North American customer plans to expand HBM production capacity from about 25K/month at the end of this year to over 70K/month next year," and "an increase in equipment orders is also expected."

He said, "Even assuming the largest customer's diversification policy, orders from other customers are increasing, so annual sales of 1 trillion won can be achieved next year." In addition, he explained, "Aggressive expansion by North American customers and equipment requests from new customers are continuing," and "new equipment tests for global OSAT and foundry customers are also underway."

This content was produced with the assistance of AI translation services.