On the 31st, Samsung Electronics stated during its Q3 earnings conference call that "the company's core business is distributing the 2㎚ (nanometer, one billionth of a meter) GAA PDK to customers and proceeding with product design," adding, "We are promoting revenue growth by continuously securing mass production capability of advanced processes and plan to secure major customer demand through successful 2㎚ mass production."


They also mentioned, "Additionally, for the 4㎚ process, we are developing process and design infrastructure to expand demand in mobile and HPC."


Samsung Electronics said, "The Foundry division is collaborating with memory companies to develop an HBM buffer die solution that integrates advanced processes and advanced packaging," and added, "We will also secure new AI and HPC customers."



Samsung Electronics Seocho Building. Photo by Jinhyung Kang aymsdream@

Samsung Electronics Seocho Building. Photo by Jinhyung Kang aymsdream@

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