SK Hynix participates in 'FMS 2024'... Showcases next-generation AI memory products

Introducing Company Vision Through Keynote Speech
Exhibition of AI Memory Product Portfolio

SK Hynix announced on the 1st that it will participate in the global memory semiconductor event 'FMS 2024' held from the 6th to the 8th (local time) in Santa Clara, California, USA, showcasing the latest artificial intelligence (AI) memory technologies and products and presenting the future vision in this field.

Until last year, FMS was mainly a global NAND flash event attended primarily by NAND companies, but as the AI era has fully begun, the organizers expanded the scope to cover the entire memory and storage sectors, including DRAM. Accordingly, the event name was rebranded from 'Flash Memory Summit' to 'Future Memory and Storage.'

SK Hynix stated, "In line with the expansion of FMS's scope, this year we have prepared extensively not only to exhibit products but also to present the company's vision through keynote speeches," emphasizing, "We will actively utilize this event as an opportunity to showcase our competitiveness leading the future of AI memory solutions across the industry." The company has been focusing on global communication through this event, such as unveiling the world's highest 321-layer NAND for the first time at last year's FMS.

SK Hynix will showcase next-generation AI memory products, including samples of the 321-layer NAND prepared for mass production in the first half of next year, at 'FMS 2024'. Image of the 321-layer NAND product. [Photo by SK Hynix]

On the first day of the event, the 6th, Kwon Eon-oh, Vice President of SK Hynix (in charge of HBM PI), and Kim Cheon-seong, Vice President (WW SSD PMO), will deliver keynote speeches on the theme "AI Era, Leadership and Vision of Memory and Storage Solutions." They will introduce SK Hynix's DRAM and NAND product portfolios and AI memory solutions. Vice President Kwon will present on DRAM, and Vice President Kim will cover NAND.

Aligned with the presentation topics, the company will showcase next-generation AI memory products at the event, including the 5th generation high-bandwidth memory (HBM) HBM3E 12-stack planned for mass production in the third quarter, and 321-layer NAND samples prepared for mass production in the first half of next year. Additionally, SK Hynix plans to exhibit customer system products equipped with its flagship products, emphasizing close partnerships with big tech customers.

The company has also decided to participate as a co-sponsor this year in the 'FMS Superwomen Conference,' held to highlight female leaders who are making a mark in the memory industry. Accordingly, at the conference held on the afternoon of the 7th, Oh Hae-soon, Vice President and SK Hynix's first female research fellow (in charge of Advanced PI), will give a presentation titled "Understanding SK Hynix's Future Technological Innovation and Diversity."

Kim Ju-seon, President of SK Hynix (in charge of AI Infrastructure), said, "As the AI era fully unfolds, the importance of memory solutions that combine multiple products to enhance performance is gradually increasing rather than individual DRAM or NAND products," adding, "Through this FMS, we will imprint our top competitiveness and technological capabilities leading this field in the global market."

This content was produced with the assistance of AI translation services.