Hanmi Semiconductor "2026 Sales Target of 2 Trillion Won"

Hanmi Semiconductor has announced its goal to achieve sales of 2 trillion KRW by 2026.

Dongshin Kwak, Vice Chairman of Hanmi Semiconductor, stated in a press release distributed on the 5th, "We plan to launch the 2.5D Big Die TC Bonder in the second half of this year, the Mild Hybrid Bonder in the second half of next year, and the Hybrid Bonder in the second half of 2026."

Hanmi Semiconductor supplies high-bandwidth memory (HBM) manufacturing equipment TC Bonders to companies such as SK Hynix and Micron. Having recently opened its sixth factory, Hanmi Semiconductor currently has the capacity to produce 264 TC Bonders annually (22 units per month). To achieve the 2 trillion KRW sales target by 2026, the company plans to secure additional land for factory expansion within this year.

The sales targets have been revised upward to 650 billion KRW this year, 1.2 trillion KRW next year, and 2 trillion KRW in 2026.

Hanmi Semiconductor stated, "Next year, with the addition of core component processing production facilities worth 20 billion KRW, we will realize the world's largest TC Bonder capacity of 420 units annually and 35 units monthly, shortening delivery times."

This content was produced with the assistance of AI translation services.