Recruitment of Exhibitors for the 'Next-Generation Semiconductor Packaging Industry Expo' Held in Suwon in August

Gyeonggi Province is recruiting companies to participate in the ‘2024 Next-Generation Semiconductor Packaging Industry Exhibition (ASPS)’ to be held in Suwon this August until the end of July.

The 2024 Next-Generation Semiconductor Packaging Industry Exhibition is an event co-hosted by Gyeonggi Province and Suwon City, taking place from August 28 to 30 at the Suwon Convention Center.

Gyeonggi Province and Suwon City are jointly supporting the budget from this year to strategically foster the semiconductor packaging industry, preparing various programs such as industrial exhibitions in the semiconductor post-processing field, international forums, technical seminars, and export consultation meetings.

In particular, a job fair to support talent recruitment essential for fostering the semiconductor industry will be held jointly with the Korea Semiconductor Industry Association.

Gyeonggi Provincial Government

The exhibition will be themed around ▲ semiconductor packaging and test process equipment ▲ semiconductor packaging materials and components ▲ semiconductor packaging technology solutions.

Participating companies can create new cooperation opportunities with major buyers such as integrated device manufacturers (IDM) and semiconductor post-processing (OSAT) companies during the exhibition period, and grasp the latest core trends in the semiconductor packaging industry through concurrently held forums and technical seminars.

Especially from this year, participation from overseas countries leading the semiconductor industry such as Taiwan, the United States, and Japan will expand.

The Taipei Computer Association (TAITRA) and the American Chamber of Commerce (AMCHAM) will support participating companies' overseas expansion through booth operations during the exhibition. Additionally, Japan’s semiconductor company Rezonac will participate as a speaker in a specialized forum to present the research achievements of the Japanese semiconductor packaging consortium ‘JOINT2 (Japan Sub-materials and Components Enterprise Alliance).’

Song Eun-sil, Director of the Semiconductor Industry Division of Gyeonggi Province, stated, "We plan to prepare various programs to share valuable advanced technology information in the semiconductor packaging field through this year’s event as well, and we hope for much interest and participation."

Meanwhile, the ‘2023 Next-Generation Semiconductor Packaging Industry Exhibition,’ first held last August, saw participation from 91 companies and institutions including Samsung Electronics and SK Hynix, with 276 booths set up, and a total of 8,296 visitors over three days.

This content was produced with the assistance of AI translation services.