TrendForce "HBM Share in DRAM Sales to Rise to 20% This Year"

It is forecasted that the share of High Bandwidth Memory (HBM) in global memory DRAM sales will rise to 20% this year.

On the 18th, market research firm TrendForce estimated that DRAM industry sales, which were $80 billion in 2022 and $51.8 billion in 2023, will increase to $84.2 billion by the end of 2024.

Additionally, the proportion of HBM in total DRAM sales is expected to rise from 2.6% in 2022 and 8.4% in 2023 to 20.1% this year.

SK Hynix HBM3E. [Photo by SK Hynix]

TrendForce stated, "Due to HBM's high average selling price (ASP) and profitability, significant investments have been made in the memory sector," and projected, "HBM's annual bit growth (production increase rate converted to bit units) will reach 260% this year."

Currently, the HBM market is virtually divided between Samsung Electronics and SK Hynix. In the case of the 4th generation HBM, HBM3, SK Hynix holds over 90% of the market share.

TrendForce reported that last year, based on wafer capacity, HBM production capacity was 45,000 wafers per month each for Samsung Electronics and SK Hynix, and 3,000 wafers per month for Micron.

It further predicted that this year, Samsung Electronics' capacity will increase to 130,000 wafers per month, SK Hynix's to between 120,000 and 125,000 wafers per month, and Micron's to 20,000 wafers per month.

This content was produced with the assistance of AI translation services.