Hanmi Semiconductor Unveils 'TC Bonder' for the First Time at SEMICON Taiwan

Semiconductor equipment company Hanmi Semiconductor will unveil the 'TC Bonder 2.0 CW,' a 2.5D package type applicable to TSMC CoWoS packages, for the first time in Taiwan.

Hanmi Semiconductor announced on the 6th that it will participate as an official sponsor in the '2023 SEMICON Taiwan Exhibition' held in Taiwan.

A Hanmi Semiconductor representative introduced, "The TC Bonder CW equipment, showcased for the first time at SEMICON Taiwan, is a 2.5D packaging bonder that attaches AI GPUs and HBM chips to silicon interposers through a thermal compression bonding method." They added, "It is characterized by its applicability to TSMC's next-generation CoWoS packaging technology, which is rapidly emerging in AI semiconductors."

Furthermore, they stated, "Based on the overwhelming technological competitiveness and know-how of the dual TC bonder, an essential process equipment for HBM, we will actively promote the TC Bonder CW equipment on-site in Taiwan, home to the world's largest semiconductor company TSMC and major OSAT companies such as ASE, Amkor, and SPIL."

Hanmi Semiconductor has filed 106 bonding equipment patents (including pending applications). It holds a dominant position with its unique technology and durability, and the competitiveness of its equipment is expected to increase further.

The 2023 SEMICON Taiwan, held until the 8th at the Nangang Exhibition Center in Taiwan, is an industrial exhibition organized by the Semiconductor Equipment and Materials International (SEMI). It is the most influential semiconductor event in Taiwan. This year, it is the largest ever, with 950 global semiconductor companies participating, including Lam Research and Disco. Hanmi Semiconductor has been participating as an official sponsor of the SEMICON Taiwan exhibition since 2015.

This content was produced with the assistance of AI translation services.