TestTech to Expand FC-BGA Quad-Type Dedicated Equipment... "Supply Expansion"

Testech, a semiconductor package substrate testing specialist, announced on the 31st that it will expand its mass production facilities from 7 to 11 units in response to the increasing demand for FC-BGA (Flip-Chip Ball Grid Array).

Testech is the only semiconductor package substrate testing company that owns dedicated FC-BGA equipment. With this facility expansion, its position as an industry leader is expected to be further strengthened.

Last year, Testech developed dedicated FC-BGA quad-type equipment through collaboration with Nidec Advance Technology Korea and KOMS. Since then, continuous facility expansion has led to the operation of 7 units, and through research and development and equipment upgrades, the company is proactively responding to increasingly stringent quality requirements from customers for high-end, high-performance product lines.

To meet the production volume demanded by customers, Testech plans to add 4 more units by 2024 to improve takt time. Takt time is the production time required to meet the production target for each product, and the shorter the takt time, the more products can be produced in the same amount of time.

A company representative stated, “As demand for high-performance semiconductor package substrates specialized for servers and automotive electronics gradually increases, we are planning to expand production facilities. Through process improvements to shorten process time and additional facility construction, we will be able to respond to additional volumes from customers.”

This content was produced with the assistance of AI translation services.