Samsung Electronics and SK Hynix Capture 90% Market Share in Rising 'HBM' Market Driven by AI Impact

TrendForce "If HBM3 Demand Increases, SK Hynix Market Share Could Reach 53%"

As shipments of artificial intelligence (AI) servers surge, the demand for high-bandwidth memory (HBM) is also rapidly increasing. Among them, a survey revealed that domestic semiconductor companies such as Samsung Electronics and SK Hynix accounted for 90% of the HBM market share last year.

Market research firm TrendForce announced on the 18th that last year’s HBM market share was ▲SK Hynix (50%) ▲Samsung Electronics (40%) ▲Micron (10%). HBM is a type of high-performance DRAM that increases bandwidth to speed up data transmission. To smoothly support AI services on servers, equipping HBM along with graphics processing units (GPUs) is essential.

TrendForce stated, "Currently, SK Hynix is the only company mass-producing HBM3 (the latest HBM product)," adding, "If the number of customers adopting HBM3 increases, (SK Hynix’s) market share could rise to 53%." It also added, "Samsung Electronics and Micron are expected to start mass production of (HBM3) by the end of this year or early next year," forecasting market shares of 38% and 9%, respectively.

Annual Global AI Server Shipment Forecast /
[Image provided by TrendForce]

TrendForce explained that as AI server shipments increase, memory demand inevitably rises as well. It also predicted that not only HBM but various memory products such as server DRAM and solid-state drives (SSD) will benefit.

TrendForce estimated that global AI server shipments increased by 9% last year compared to the previous year. This year, major global companies such as Microsoft, Meta, Baidu, and ByteDance are all launching generative AI products and services, and shipments are expected to increase by 15.4%. It also forecasted that the compound annual growth rate of shipments from this year to 2027 will be 12.2%.

This content was produced with the assistance of AI translation services.