Hanmi Semiconductor Participates in Semicon Korea Exhibition

[Asia Economy Reporter Hyungsoo Park] Semiconductor equipment company Hanmi Semiconductor announced on the 3rd that it showcased the ‘Full Automation Wafer Micro Saw (micro SAW W1121α),’ a wafer cutting saw (SAW) equipment, at the '2023 SEMICON Korea Exhibition.'

A Hanmi Semiconductor official introduced, "The wafer micro saw, introduced for the first time in Korea, is a fully automated standalone 12-inch wafer saw equipment that cuts wafers attached to wafer rings or tape in semiconductor manufacturing processes."

He added, "Based on over 42 years of Hanmi Semiconductor’s experience and know-how, we have integrated precision processing, vision, and setting technologies," and "We have significantly enhanced productivity, precision, and user convenience features compared to competitors."

He emphasized, "Confident in the quality, Hanmi Semiconductor provides a 2-year warranty on the micro saw equipment," and "We will create new sales separately from Hanmi Semiconductor’s existing main equipment through the micro saw equipment."

Hanmi Semiconductor launched the dual chuck micro saw, jumbo PCB micro saw, tape micro saw, and glass micro saw, which were first successfully domestically produced in June 2021. The newly introduced wafer micro saw is the sixth cutting equipment released by Hanmi Semiconductor.

The 2023 SEMICON Korea Exhibition, held at COEX Exhibition Center in Samseong-dong, Gangnam-gu, Seoul, features 450 companies including semiconductor chip manufacturers and material, parts, and equipment companies.

This content was produced with the assistance of AI translation services.