Samsung Electro-Mechanics Focuses on Server FCBGA at Korea's Largest Substrate Exhibition
Exhibition of High-Performance, High-Density, Ultra-Slim Semiconductor Package Substrates for 5G, AI, and Automotive Applications
[Asia Economy Reporter Park Sun-mi] Samsung Electro-Mechanics announced on the 20th that it will participate in 'KPCA Show 2022,' the largest substrate exhibition in Korea, to unveil its next-generation semiconductor package technology. 'KPCA Show 2022' is the largest domestic substrate exhibition featuring domestic and international substrate, material, and equipment companies, and will be held from the 21st to the 23rd at Songdo Convensia in Incheon.
Samsung Electro-Mechanics plans to focus on exhibiting high-performance FCBGA, including server-use FCBGA scheduled for production starting at the end of this year. FCBGA connects semiconductor chips and package substrates using the flip-chip method and is a highly integrated package substrate that improves electrical and thermal characteristics. It is a high-spec product mainly used in CPUs (Central Processing Units) and GPUs (Graphics Processing Units), which exchange many electrical signals, with server-use FCBGA being the most technically challenging. To support high-speed signal processing, the product size (area) is approximately 75mm x 75mm, four times larger than general FCBGA, and the internal layer count is more than 20 layers, twice that of general products.
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Samsung Electro-Mechanics will also exhibit ultra-small, high-density semiconductor substrates for mobile IT. They will introduce FCCSP, a product that reduces thickness by 50% compared to existing products by applying a coreless process that removes the core (internal support layer) inside the semiconductor substrate, and SiP, which embeds multiple semiconductor chips and passive components such as MLCCs inside the package substrate.
A Samsung Electro-Mechanics official stated, "To maintain our technological lead in semiconductor package substrates, we have been focusing on large-scale proactive investments amounting to a cumulative 1.9 trillion KRW since the end of last year," adding, "We will showcase high-performance, high-density, ultra-slim next-generation semiconductor package substrates at this exhibition."
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