Hanmi Semiconductor Launches TC Bonder 2.0CS for Silicon Through-Electrodes

[Asia Economy Reporter Hyungsoo Park] Global semiconductor equipment company Hanmi Semiconductor announced on the 23rd that it has newly launched the TC bonder, an essential process equipment for TSV 3D semiconductor high-performance packaging that attaches semiconductor chips to circuit boards (Substrate) through thermal compression bonding, for the first time in six years.

Kim Minhyun, President of Hanmi Semiconductor, introduced, "The newly launched TC bonder for Through-Silicon Via (TSV) is emerging as essential process equipment for producing High Bandwidth Memory semiconductors (HBM) applied in high-performance semiconductor packaging fields such as chiplets and multichip, overcoming the microfabrication limits of semiconductor production."

He continued, "We have consolidated Hanmi Semiconductor’s 40 years of know-how and technology," adding, "We have entered overseas markets by significantly improving compact equipment size, high productivity, and precision compared to competitors in a market previously led by European and Japanese semiconductor equipment companies."

Furthermore, he emphasized, "With Intel’s new server CPU development and the growth of the 4th industrial market including metaverse, artificial intelligence (AI), electric vehicles, and autonomous driving, we expect an increase in demand for the TC bonder for TSV, which is equipment for producing HBM semiconductors."

Hanmi Semiconductor, established in 1980, received the '2 Billion Dollar Export Tower' award at the 58th Trade Day ceremony held earlier this month.

According to data released last month by the World Semiconductor Trade Statistics (WSTS), the global semiconductor market is expected to grow from $553 billion (approximately 658 trillion KRW) in 2021 to $601.5 billion (approximately 716 trillion KRW) in 2022.

This content was produced with the assistance of AI translation services.