Mokpo National University Operates Employment-Linked Program with US-Based Semiconductor Company Amkor Technology Korea Co., Ltd.
[Asia Economy Honam Reporting Headquarters Reporter Seo Young-seo] The Department of Information and Electronic Engineering at National Mokpo University (President Park Min-seo) announced on the 13th that it will operate a large-scale recruitment-linked program with Meco Korea Co., Ltd.
Meco Technology, the world's second-largest packaging company, is a U.S.-based semiconductor packaging specialist with annual sales of approximately 7 trillion KRW and about 70,000 employees. It is a foreign company that achieved sales of 2.6277 trillion KRW last year at its Korean branch alone, maintaining strong growth with major partner Samsung Electronics.
In September 2021, Meco Technology, a leading company in the domestic and international semiconductor packaging field, promised practical cooperation for undergraduate R&D recruitment and workforce development with the Department of Information and Electronic Engineering at National Mokpo University (Department Head Professor Jeon Hee-seok).
Since 2022, the Department of Information and Electronic Engineering at National Mokpo University has been jointly training full-time semiconductor engineers in R&D by early selecting recruitment candidates among third-year second-semester students and providing long-term field training in collaboration with Meco Technology.
Students selected together with Meco Technology Korea from the Department of Information and Electronic Engineering at Mokpo University are expected to be mostly converted to full-time positions once they meet certain qualification requirements.
For this program, the Department of Information and Electronic Engineering at National Mokpo University is prioritizing the internal selection of more than 10 third-year students and providing education in foreign languages and semiconductor practical knowledge.
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Prior to this, under the guidance of Professor Jeon Hee-seok, two students from the Department of Information and Electronic Engineering (Jinwook Jeong, graduated in 2021, and Hyunmo Kim, expected to graduate in 2022) were finally accepted in the second half of 2021 recruitment.
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