Contributing to Enhancing National Competitiveness in Substrate Materials

Gil-dong Son, Executive Vice President, Substrate Materials Division, LG Innotek

Gil-dong Son, Executive Vice President, Substrate Materials Division, LG Innotek

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[Asia Economy Reporter Ki-min Lee] Son Gil-dong, Executive Vice President and Head of the Substrate Materials Division at LG Innotek, received the Presidential Citation at the '15th Electronics and IT Day' event on the 10th.


Electronics and IT Day is an event hosted annually by the Electronics and Telecommunications Industry Promotion Association to honor and encourage contributors who have strengthened the competitiveness of the electronics and IT industry. It was established in 2005 to commemorate the achievement of $100 billion in electronics and IT exports.


LG Innotek explained that EVP Son was recognized for his contributions to enhancing the national competitiveness of the substrate materials industry. Son joined LG Electronics in 1995 as a substrate developer and has led various fields such as production and marketing in LG Innotek's Substrate Materials Division since 2008, spearheading the development of new technologies and processes. LG Innotek stated that Son contributed to nurturing communication semiconductor substrates, tape substrates, and photomasks into global number one products.


Among these, the RF-SiP (Radio Frequency-System in Package) substrate for communication semiconductors applies differentiated microcircuits, coreless (removal of the core layer in semiconductor substrates), and other ultra-precision and high-integration technologies along with new materials, significantly reducing thickness and signal loss compared to existing products. LG Innotek holds a 32% global market share in RF-SiP as of last year and has maintained the global number one position since 2018.


Additionally, EVP Son has actively promoted development and investment to expand the millimeter-wave (㎜Wave) antenna module substrate (AiP, Antenna in Package) business in response to the spread of 5G. In particular, by combining RF technology with semiconductor substrates, he is expanding the business into adjacent areas, further solidifying the number one position in communication semiconductor substrates.


Furthermore, LG Innotek stated that EVP Son has continuously improved production efficiency by accelerating factory automation through digital transformation. He also enhanced process speed through optimization of tape substrate equipment and secured high-resolution inspection capabilities, raising daily production volume to the industry's highest level. For photomasks, he internalized core processes to shorten production time and introduced new processes at various stages to maximize process speed, securing the industry's highest production operation rate.



EVP Son said, "I am very pleased that this award recognizes LG Innotek's competitiveness in the substrate materials business. We will focus on enhancing customer value by pioneering ultra-slim, high-performance, and highly integrated substrates optimized for 5G, foldable phones, OLED, and more through innovative technologies."


This content was produced with the assistance of AI translation services.

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