SK hynix Recognized for HBM Innovation... Wins Its First IEEE Corporate Innovation Award in the US

President Hyun Ahn: "A Leading Company Driving AI Innovation"

Proactive Response to Customer Demand with HBM Solutions

First Recipient Following Intel, Sony, Qualcomm, and Others

SK hynix has been awarded the Corporate Innovation Award by the Institute of Electrical and Electronics Engineers (IEEE), the world’s most prestigious organization of technical professionals, in recognition of its achievements in HBM (High Bandwidth Memory) technology innovation.

SK hynix announced on the 26th that it received the Corporate Innovation Award at the 2026 IEEE Awards Ceremony held on the 24th (local time) in New York, USA.

The IEEE Awards, hosted by IEEE and with a history spanning over 100 years, select honorees who have made technological innovations and contributed to societal advancement in three categories: Medals, Technical Field Awards, and Recognitions.

The Corporate Innovation Award, which falls under the Recognitions category, has been presented since 1986 to companies that have contributed to industry and society through innovative technologies. This is the first time SK hynix has received the award. The IEEE Corporate Innovation Award is presented to global technology companies in recognition of their innovative achievements, and previous recipients include Intel, Sony, IBM, Apple, Microsoft, TSMC, Qualcomm, and Samsung Electronics.

The company stated, “We have been recognized for reliably mass-producing every generation of HBM and contributing to the vitalization of the global AI computing ecosystem. We will establish ourselves as a trusted partner in the global AI (Artificial Intelligence) market by providing decisive memory solutions that help overcome performance limitations of AI platforms.”

Hyun Ahn, President and Chief Development Officer (CDO) of SK hynix, is delivering an acceptance speech for the Corporate Innovation Award at the 2026 IEEE Awards Ceremony in New York, USA. SK hynix.

The company explained that this award recognizes its contribution to the proliferation of AI computing through HBM innovation and applications, emphasizing that its proactive introduction of innovative HBM solutions in the global AI market, and timely response to customer demand, were key factors.

The company’s ongoing expansion of AI infrastructure partnerships with global big tech companies in the United States was also cited as a foundation for this achievement. Since SK hynix first developed HBM in 2013 through joint research with AMD and succeeded in mass production in 2015, it has continued to drive technological evolution by being the first in the world to develop and mass-produce each generation of products, including HBM2, HBM2E, HBM3, and HBM3E. Notably, in 2025, SK hynix supplied HBM4 samples to key customers for the first time globally and established mass production capabilities in September of the same year.

At the awards ceremony, Hyun Ahn, President and Chief Development Officer (CDO), attended as the company’s representative and accepted the award. President Ahn stated, “It is an honor to accept this award on behalf of all SK hynix members who have continuously challenged and overcome technological limits,” adding, “We will become a leading company in AI innovation by working closely with global customers and partners to proactively create the value demanded by the market.”

This content was produced with the assistance of AI translation services.