Hanwha Semitech Unveils New Chip Mounter at Korea’s Largest SMT Exhibition
Participating in “SSPA 2026”
Unveiling “DECAN S1 Plus” and “DECAN S2 Plus”
Hanwha Semitech announced on April 2 that it unveiled a new chip mounter targeting the next-generation equipment market at “SSPA (Smart SMT&PCB Assembly) 2026,” Korea’s largest surface-mount technology (SMT) exhibition, which opened for three days at Suwon Convention Center in Gyeonggi Province on April 1.
On this day, Hanwha Semitech showcased its main new products, including the high-performance chip mounters “DECAN S1 Plus” and “DECAN S2 Plus.”
The DECAN series can accommodate a wide range of components. The new high-speed mounter, “DECAN S2 Plus,” improves both placement speed and quality compared to previous models. By reducing board recognition time by approximately 30% compared to earlier products, it achieves a maximum mounting capacity of 95,000 chips per hour.
In particular, Hanwha Semitech’s independently developed next-generation vision technology enables automatic detection and precise correction of mounting positions, minimizing component and cost losses.
This product can also accommodate heavy printed circuit boards (PCBs) weighing up to 4.5 kg. Usability has been further enhanced with a user-friendly interface (UI) and a larger display screen.
Hanwha Semitech also introduced other products, including the high-speed chip mounter “HM520W,” the software solution “T-solution” that supports smart factory implementation across the entire production process, and autonomous mobile robots (AMR) applicable to the SMT process.
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A Hanwha Semitech official stated, “Starting with this exhibition, we aim to demonstrate our technological competitiveness in high-growth, high-value-added electronics industries, such as servers, data centers, networks, and automotive electronics. We will also strengthen our position as a global leader in AI-based automation.”
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