SK Hynix with HBM Takes the Lead in 'Carbon Reduction'... Earns Carbon Trust Certification

Certified for Carbon Reduction and Carbon Footprint
From Four HBM Models to NAND and Five DRAM Products
Proven Achievements in Actual Carbon Emission Reduction

SK Hynix has obtained both 'Carbon Reduction' and 'Carbon Footprint' certifications from the global environmental certification body, Carbon Trust, for 15 types of memory products, including high-bandwidth memory (HBM).

On November 5, SK Hynix stated, "SK Hynix's HBM, which has been recognized for its industry-leading performance and technology in the global AI market, has now also been internationally certified for its environmental excellence," adding, "We aim to set a new industry standard with products that meet global benchmarks in both performance and environmental sustainability."

The Carbon Reduction certification is an international recognition granted to companies or products that have scientifically managed their greenhouse gas emissions and demonstrated actual carbon reduction compared to equivalent products from the previous year. The Carbon Footprint certification is awarded to products that quantify and publicly disclose the greenhouse gas emissions generated throughout their entire life cycle (from raw material extraction, production, and distribution to use and disposal).

The HBM products that received the Carbon Reduction certification this time include four models: 16GB HBM2E 8-layer, 16GB HBM3 8-layer, 24GB HBM3E 8-layer, and 36GB HBM3E 12-layer. SK Hynix is the only company to have obtained this certification for both fourth-generation (HBM3) and fifth-generation (HBM3E) HBM products.

At the Carbon Trust certification award ceremony held on the 4th at SK Hynix headquarters in Icheon, Gyeonggi Province, Lee Byungki, Executive Vice President of Manufacturing Technology at SK Hynix (left), and Hugh Jones, Head of Certification at Carbon Trust (right), are taking a commemorative photo. SK Hynix.

In addition, seven DRAM products also received the Carbon Reduction certification: two low-power mobile DRAM (LPDDR5) models, two graphic DRAM (GDDR6) models, and three server memory module (DDR5 DIMM) models. Furthermore, four NAND and storage products earned the Carbon Footprint certification: one NAND flash model, two embedded solid-state drive (eSSD) models, and one consumer SSD (cSSD) model.

Notably, among the 15 certified products, the four HBM models and seven DRAM models received the Carbon Reduction certification for demonstrating actual reductions in carbon emissions compared to equivalent products from the previous year, making this achievement particularly significant.

Last year, SK Hynix also expanded its certification scope by obtaining Carbon Reduction certification for six products, including LPDDR5, DDR5, and cSSD, as well as Carbon Footprint certification for NAND, Universal Flash Storage (UFS), and eSSD products. Through these efforts, the company has transparently demonstrated its carbon reduction achievements to global customers and investors.

The company stated, "We will continue to advance our science-based carbon management system and lead the way toward a sustainable future in the semiconductor industry."

Lee Byungki, Executive Vice President of Manufacturing Technology at SK Hynix, said, "Based on our six codes of conduct, SK Hynix is realizing a sustainable future by expanding global environmental certifications," adding, "We will continue to minimize greenhouse gas emissions during product manufacturing and prioritize customer satisfaction by strengthening product competitiveness with environmental considerations."

This content was produced with the assistance of AI translation services.